We are committed to thermal management research for all physical objects. Currently focusing on PCB thermal design, network module and AI module heat dissipation optimization. We also conduct in-depth research on robotic and unmanned machinery thermal management. In the future, we will continuously explore thermal control technology for human wearable environmental chambers. We aim to optimize the temperature field of both inanimate equipment and living environments to create the most stable and suitable thermal conditions for all products and scenarios.
我们致力于一切事物的热管理研究,目前专注于PCB热设计、网络模块与AI模块散热优化,同时深耕机器人、无人机械热管理技术。未来持续探索穿戴式人体环境仓温控研究。我们致力于优化无生命设备与生命场景的温度场,为所有产品与应用场景创造最稳定、适宜的热环境。
We focus on full-scenario thermal design, covering electronic hardware, intelligent equipment and human environment thermal regulation.
我们专注全场景热设计研究,覆盖电子硬件、智能装备、人体环境温控领域。
Complete thermal simulation, stack structure optimization, thermal pad matching and enclosure heat dissipation design for high-density PCBs and network mainboard modules.
针对高密度PCB、网络主板模块,完成全套热仿真、堆叠结构优化、导热垫匹配、壳体散热设计。
Aiming at high-power AI computing modules, solve local overheating, heat accumulation and temperature difference problems through radiator selection and interface thermal resistance optimization.
针对大功率AI算力模块,通过散热器选型、界面热阻优化,解决局部过热、积热、温差过大问题。
Research on overall temperature field distribution of industrial and service robots, optimize heat dissipation of joint motors, control boards and battery modules.
研究工业、服务机器人整体温度场分布,优化关节电机、控制板、电池模块散热方案。
Thermal design for vehicle-mounted computing boxes, sensor modules and power systems to adapt to high-temperature and variable ambient temperature scenarios.
针对车载算力盒、传感器、电源系统做专项热设计,适配户外高温、变温复杂工况。
Explore micro-temperature field control technology for wearable human body cabins, optimize local constant temperature and heat balance for human body comfort.
探索穿戴式人体微环境温控技术,优化局部恒温、热平衡,提升人体环境适配性与舒适度。
We provide technical discussion channels for PCB thermal design, radiator selection, thermal pad application and future thermal engineering challenges.
开设PCB热设计、散热器选型、导热材料应用、未来热设计挑战四大交流板块,支持提问与技术交流。
Discuss PCB stack thermal optimization, via thermal design, board-level heat dissipation and common overheating problems.
交流PCB堆叠热优化、过孔导热、板级散热、常见过热问题解决方案。
Discuss profile heat sinks, skived heat sinks, fin density matching, wind resistance and power matching schemes.
讨论型材散热器、铲齿散热器、翅片密度匹配、风阻与功率匹配方案。
Thermal conductivity selection, thickness tolerance, compression ratio, interface gap matching and application scenarios.
导热系数选型、厚度公差、压缩率、界面间隙匹配与场景适配交流。
High-density chip heat dissipation, ultra-thin equipment thermal resistance, extreme temperature environment thermal management research.
高密度芯片散热、超薄设备热阻、极端温区设备热管理前沿问题探讨。
Self-developed and customized thermal management hardware products for electronic thermal optimization scenarios.
自研与定制化热管理硬件产品,适配各类电子散热优化场景。
Custom aluminum alloy PCB housing, shielded & heat-conductive structure.
定制铝合金PCB壳体,兼顾屏蔽与导热结构设计。
3W~30W high thermal conductivity pads for chip interface heat conduction.
3W~30W高导热垫片,适配芯片界面导热填充。
Extruded & skived heat sinks for PCB and AI module cooling.
型材、铲齿标准散热器,适配PCB与AI模块散热。
Thermal silicone adhesive & potting compound for fixed heat conduction.
导热硅胶、灌封胶,用于结构固定与界面导热。
Company Name: Huazhong Machinery Science and Technology Center(Jinan Lixia ) (HZ-Thermo)
公司名称:济南市历下华中机械科技中心(HZ-Thermo)
Address: Jinan, Shandong, China
地址:中国山东省济南市
Email: froest66@gmail.com
邮箱:froest66@gmail.com
Public technical papers, thermal design guidelines and product specification documents.
公开技术资料、热设计指南、产品规格文档下载。